US Patent Issued to SAMSUNG ELECTRO-MECHANICS on March 25 for "Printed circuit board including an insulating layer and a metal post" (South Korean Inventors)

ALEXANDRIA, Va., March 26 -- United States Patent no. 12,262,467, issued on March 25, was assigned to SAMSUNG ELECTRO-MECHANICS Co. LTD. (Suwon-si, South Korea).

"Printed circuit board including an insulating layer and a metal post" was invented by Tae Hong Min (Suwon-si, South Korea) and Eun Su Kwon (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A printed circuit board includes a first insulating layer, a first pattern buried in a surface of the first insulating layer, the first pattern having a surface exposed from the surface of the first insulating layer, and a metal post disposed on the exposed surface of the first pattern. The metal post includes a first metal layer and a second ...