US Patent Issued to SAMSUNG ELECTRO-MECHANICS on March 18 for "Multilayer electronic component" (South Korean Inventors)

ALEXANDRIA, Va., March 19 -- United States Patent no. 12,255,025, issued on March 18, was assigned to SAMSUNG ELECTRO-MECHANICS Co. LTD. (Suwon-si, South Korea).

"Multilayer electronic component" was invented by YoonA Park (Suwon-si, South Korea), KangHa Lee (Suwon-si, South Korea), Myung Jun Park (Suwon-si, South Korea), WooKyung Sung (Suwon-si, South Korea), JinSoo Park (Suwon-si, South Korea) and SoEun Choi (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "An electronic component includes: a body including a dielectric layer and internal electrodes, and including first to sixth surfaces; a first external electrode including a connection portion on the third surface, and first and third...