ALEXANDRIA, Va., June 25 -- United States Patent no. 12,340,945, issued on June 24, was assigned to SAMSUNG ELECTRO-MECHANICS Co. LTD. (Suwon-si, South Korea).
"Multilayer electronic component" was invented by Jin Soo Park (Suwon-si, South Korea), Eui Hyun Jo (Suwon-si, South Korea), Jun Hyeong Kim (Suwon-si, South Korea), Ha Jeong Kim (Suwon-si, South Korea), Hyun Hee Gu (Suwon-si, South Korea), Woo Kyung Sung (Suwon-si, South Korea), Myung Jun Park (Suwon-si, South Korea), Byung Jun Jeon (Suwon-si, South Korea) and Chul Seung Lee (Suwon-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A multilayer electronic component includes a body including a dielectric layer and internal electrodes stacke...