ALEXANDRIA, Va., June 25 -- United States Patent no. 12,340,946, issued on June 24, was assigned to SAMSUNG ELECTRO-MECHANICS Co. LTD. (Suwon-si, South Korea).
"Multilayer electronic component" was invented by Sin Il Gu (Suwon-si, South Korea) and Jin Hyung Lim (Suwon-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A multilayer electronic component including: a body including a capacitance formation portion, cover portions disposed on surfaces on the capacitance formation portion opposing each other in one direction, and margin portions disposed on surfaces of the capacitance formation portion opposing each other in another direction; a first external electrode; a second external electrode, an...