ALEXANDRIA, Va., June 25 -- United States Patent no. 12,340,944, issued on June 24, was assigned to SAMSUNG ELECTRO-MECHANICS Co. LTD. (Suwon-si, South Korea).
"Multilayer electronic component" was invented by Jun Il Song (Suwon-si, South Korea), Byung Woo Han (Suwon-si, South Korea) and Do Hoon Kim (Suwon-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A multilayer electronic component, includes: a body including a stack portion having a dielectric layer and an internal electrode disposed in a first direction, a connection electrode disposed on an end surface of the stack portion in a second direction, to be connected to the internal electrode, and an insulating layer covering the connection ...