ALEXANDRIA, Va., June 19 -- United States Patent no. 12,334,269, issued on June 17, was assigned to SAMSUNG ELECTRO-MECHANICS Co. LTD. (Suwon-si, South Korea).
"Multilayer electronic component" was invented by Yoona Park (Suwon-si, South Korea), Kangha Lee (Suwon-si, South Korea), Hye Young Choi (Suwon-si, South Korea), Dong Ha Kang (Suwon-si, South Korea) and Chul Seung Lee (Suwon-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A multilayer electronic component, in which an external electrode may include a base electrode layer disposed on a surface of a body of the multilayer electronic component and connected to internal electrodes of the body, an intermediate electrode layer disposed on a c...