ALEXANDRIA, Va., June 19 -- United States Patent no. 12,334,268, issued on June 17, was assigned to SAMSUNG ELECTRO-MECHANICS Co. LTD. (Suwon-si, South Korea).
"Multilayer electronic component" was invented by Ji Hye Han (Suwon-si, South Korea), Jung Min Kim (Suwon-si, South Korea), Hong Je Choi (Suwon-si, South Korea), Byung Woo Kang (Suwon-si, South Korea), Hye Jin Park (Suwon-si, South Korea), Sang Wook Lee (Suwon-si, South Korea) and Bon Seok Koo (Suwon-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A multilayer electronic component includes a body including a dielectric layer and a plurality of internal electrodes stacked with the dielectric layer interposed therebetween and external ele...