US Patent Issued to SAMSUNG ELECTRO-MECHANICS on June 10 for "Printed circuit board and a semiconductor package including the same" (South Korean Inventors)

ALEXANDRIA, Va., June 18 -- United States Patent no. 12,328,820, issued on June 10, was assigned to SAMSUNG ELECTRO-MECHANICS Co. LTD. (Suwon-si, South Korea).

"Printed circuit board and a semiconductor package including the same" was invented by Gopal Garg (Suwon-si, South Korea), Jung Hyun Cho (Suwon-si, South Korea) and Yong Ho Baek (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A printed circuit board includes a substrate structure including a first insulating material, a plurality of first wiring layers disposed on or in the first insulating material, and a plurality of first via layers disposed in the first insulating material; and an interconnect structure including a second ins...