US Patent Issued to SAMSUNG ELECTRO-MECHANICS on July 8 for "Multilayer electronic component having structure for improved adhesion force and moisture protection" (South Korean Inventors)

ALEXANDRIA, Va., July 9 -- United States Patent no. 12,354,803, issued on July 8, was assigned to SAMSUNG ELECTRO-MECHANICS Co. LTD. (Suwon-si, South Korea).

"Multilayer electronic component having structure for improved adhesion force and moisture protection" was invented by Hyung Jong Choi (Suwon-si, South Korea), Yoo Jeong Lee (Suwon-si, South Korea), Chung Yeol Lee (Suwon-si, South Korea), Kwang Yeun Won (Suwon-si, South Korea), So Jung An (Suwon-si, South Korea), Kang Ha Lee (Suwon-si, South Korea), Woo Kyung Sung (Suwon-si, South Korea), Myung Jun Park (Suwon-si, South Korea) and Jong Ho Lee (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A multilayer electronic component includes...