ALEXANDRIA, Va., July 9 -- United States Patent no. 12,354,807, issued on July 8, was assigned to SAMSUNG ELECTRO-MECHANICS Co. LTD. (Suwon-si, South Korea).

"Multilayer electronic component and method of manufacturing the same" was invented by Kangha Lee (Suwon-si, South Korea), Yoona Park (Suwon-si, South Korea), Jinsoo Park (Suwon-si, South Korea), Wookyung Sung (Suwon-si, South Korea), Eunme Park (Suwon-si, South Korea), Jung Min Kim (Suwon-si, South Korea), Ji Hye Han (Suwon-si, South Korea) and Jong Ho Lee (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A multilayer electronic component includes a body including first and second surfaces opposing each other in the first direction,...