ALEXANDRIA, Va., July 9 -- United States Patent no. 12,354,805, issued on July 8, was assigned to SAMSUNG ELECTRO-MECHANICS Co. LTD. (Suwon-si, South Korea).
"Multilayer electronic component" was invented by Jun Il Song (Suwon-si, South Korea), Sung Hyung Kang (Suwon-si, South Korea), Sun Joo Hyun (Suwon-si, South Korea) and Dong Uk Kim (Suwon-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A multilayer electronic component includes: a body including a dielectric layer and first and second internal electrode layers disposed with the dielectric layer interposed therebetween and having opposing first and second surfaces, opposing third and fourth surfaces, and opposing fifth and sixth surfaces; ...