ALEXANDRIA, Va., July 9 -- United States Patent no. 12,354,806, issued on July 8, was assigned to SAMSUNG ELECTRO-MECHANICS Co. LTD. (Suwon-si, South Korea).

"Multilayer electronic component" was invented by Jeong Bong Park (Suwon-si, South Korea), Han Bok Lee (Suwon-si, South Korea), Da Jeong Han (Suwon-si, South Korea) and Hye Soo Chung (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A multilayer electronic component includes: a body including a dielectric layer, first and second internal electrodes, alternately disposed with the dielectric layer disposed therebetween, first and second surfaces opposing each other in a first direction, third and fourth surfaces connected to the first ...