US Patent Issued to SAMSUNG ELECTRO-MECHANICS on July 29 for "Multilayer electronic component and method of manufacturing the same" (South Korean Inventors)

ALEXANDRIA, Va., July 30 -- United States Patent no. 12,374,492, issued on July 29, was assigned to SAMSUNG ELECTRO-MECHANICS Co. LTD. (Suwon-si, South Korea).

"Multilayer electronic component and method of manufacturing the same" was invented by Seok Hyun Yoon (Suwon-si, South Korea), In Ho Jeon (Suwon-si, South Korea), Yun Jung Park (Suwon-si, South Korea), Jin Woo Kim (Suwon-si, South Korea), Mi Yang Kim (Suwon-si, South Korea) and Se Yoon Park (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A multilayer electronic component includes a body including a dielectric layer and an internal electrode; and an external electrode disposed on the body, wherein the dielectric layer includes a p...