ALEXANDRIA, Va., July 30 -- United States Patent no. 12,374,498, issued on July 29, was assigned to SAMSUNG ELECTRO-MECHANICS Co. LTD. (Suwon-si, South Korea).
"Multilayer electronic component" was invented by Jin Soo Park (Suwon-si, South Korea), Eui Hyun Jo (Suwon-si, South Korea) and Hyun Hee Gu (Suwon-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A multilayer electronic component includes a body including a dielectric layer and first and second internal electrodes alternately disposed with the dielectric layer interposed therebetween, and having first and second surfaces opposing in a first direction, third and fourth surfaces connected to the first and second surfaces and opposing each ...