ALEXANDRIA, Va., July 30 -- United States Patent no. 12,374,496, issued on July 29, was assigned to SAMSUNG ELECTRO-MECHANICS Co. LTD. (Suwon-si, South Korea).
"Multilayer electronic component" was invented by Kangha Lee (Suwon-si, South Korea), Wookyung Sung (Suwon-si, South Korea), Jin Hyung Lim (Suwon-si, South Korea), Sin Il Gu (Suwon-si, South Korea) and Jong Ho Lee (Suwon-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A multilayer electronic component, may include: a body including a dielectric layer and first and second internal electrodes alternately disposed with the dielectric layer interposed therebetween, the body having first and second surfaces opposing each other, third and fou...