ALEXANDRIA, Va., July 16 -- United States Patent no. 12,363,815, issued on July 15, was assigned to SAMSUNG ELECTRO-MECHANICS Co. LTD. (Suwon-si, South Korea).
"Film for manufacturing electronic component" was invented by Dae Jin Shim (Suwon-si, South Korea), Jung Jin Park (Suwon-si, South Korea), Su Min Kim (Suwon-si, South Korea), Jong Ho Lee (Suwon-si, South Korea), Eun Jung Lee (Suwon-si, South Korea) and Jung Jin Park (Suwon-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A film for manufacturing an electronic component includes: a polymer layer; and metal nanowires dispersed in the polymer layer. The polymer layer may include a polyester-based compound such as polyethylene terephthalate....