US Patent Issued to SAMSUNG ELECTRO-MECHANICS on July 1 for "Multilayer electronic component with a copper-containing external electrode" (South Korean Inventors)

ALEXANDRIA, Va., July 3 -- United States Patent no. 12,347,622, issued on July 1, was assigned to SAMSUNG ELECTRO-MECHANICS Co. LTD. (Suwon-si, South Korea).

"Multilayer electronic component with a copper-containing external electrode" was invented by Young Ah Song (Suwon-si, South Korea), Bong Gyu Choi (Suwon-si, South Korea), Kwang Dong Seong (Suwon-si, South Korea), Jae Hoon Bang (Suwon-si, South Korea), Do Kyeong Lee (Suwon-si, South Korea) and Wan Sik Kim (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "Provided is a multilayer electronic component, the multilayer electronic component including: a body including a dielectric layer and internal electrodes alternately disposed with th...