ALEXANDRIA, Va., July 3 -- United States Patent no. 12,349,283, issued on July 1, was assigned to SAMSUNG ELECTRO-MECHANICS Co. LTD. (Suwon-si, South Korea).
"Electronic component embedded substrate" was invented by Jae Ho Shin (Suwon-si, South Korea) and Ga Young An (Suwon-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "An electronic component embedded substrate includes: a core layer having a first through portion; an electronic component module including at least one electronic component and a metal layer surrounding at least a portion of the electronic component and disposed in the first penetration portion; and a first encapsulant disposed on the core layer, disposed in at least a portion...