US Patent Issued to SAMSUNG ELECTRO-MECHANICS on Jan. 28 for "Printed circuit board and electronic component package including the same" (South Korean Inventors)

ALEXANDRIA, Va., Jan. 29 -- United States Patent no. 12,211,816, issued on Jan. 28, was assigned to SAMSUNG ELECTRO-MECHANICS Co. LTD. (Suwon-si, South Korea).

"Printed circuit board and electronic component package including the same" was invented by Young Kuk Ko (Suwon-si, South Korea), Sang Hoon Kim (Suwon-si, South Korea), Suk Chang Hong (Suwon-si, South Korea), Chi Won Hwang (Suwon-si, South Korea) and Gyu Mook Kim (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A printed circuit board includes: a first insulating layer; a first cavity disposed in one surface of the first insulating layer; a plurality of protrusion portions spaced apart from each other in the first cavity; and a fi...