ALEXANDRIA, Va., Jan. 28 -- United States Patent no. 12,537,137, issued on Jan. 27, was assigned to SAMSUNG ELECTRO-MECHANICS Co. LTD. (Suwon-si, South Korea).
"Multilayer electronic component" was invented by Hyung Soon Kwon (Suwon-si, South Korea), Hyoung Uk Kim (Suwon-si, South Korea), Han Seong Jung (Suwon-si, South Korea), Ji Su Hong (Suwon-si, South Korea), Hye Won Ryoo (Suwon-si, South Korea) and Jae Sung Park (Suwon-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A multilayer electronic component includes a body including a dielectric layer and an internal electrode disposed alternately with the dielectric layer in a first direction, and an external electrode disposed on the outside of...