ALEXANDRIA, Va., Jan. 28 -- United States Patent no. 12,537,138, issued on Jan. 27, was assigned to SAMSUNG ELECTRO-MECHANICS Co. LTD. (Suwon-si, South Korea).
"Multilayer electronic component" was invented by So Jung An (Suwon-si, South Korea), Hyung Jong Choi (Suwon-si, South Korea), Jung Won Park (Suwon-si, South Korea), Yoo Jeong Lee (Suwon-si, South Korea), Kwang Yeun Won (Suwon-si, South Korea), Woo Kyung Sung (Suwon-si, South Korea), Byung Jun Jeon (Suwon-si, South Korea) and Chul Seung Lee (Suwon-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A multilayer electronic component may include: a body including a dielectric layer and internal electrodes; and external electrodes including an...