ALEXANDRIA, Va., Jan. 13 -- United States Patent no. 12,526,930, issued on Jan. 13, was assigned to SAMSUNG ELECTRO-MECHANICS Co. LTD. (Suwon-si, South Korea).
"Printed circuit board and method of manufacturing the same" was invented by Tae Hong Min (Suwon-si, South Korea) and Eun Su Kwon (Suwon-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A printed circuit board includes a first build-up insulating layer; an interconnect structure buried in an upper side of the first build-up insulating layer and including one or more insulating layers, one or more wiring layers, and one or more via layers; an adhesive disposed between an upper surface of the first build-up insulating layer and an upper su...