ALEXANDRIA, Va., Jan. 13 -- United States Patent no. 12,526,919, issued on Jan. 13, was assigned to SAMSUNG ELECTRO-MECHANICS Co. LTD. (Suwon-si, South Korea).
"Printed circuit board" was invented by Sangik Cho (Suwon-si, South Korea), Mi Jung Park (Suwon-si, South Korea), Mi Geum Kim (Suwon-si, South Korea), Yong Su Lee (Suwon-si, South Korea), Sung Han (Suwon-si, South Korea) and Jong Eun Park (Suwon-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A printed circuit board includes: a first metal layer; an organic insulating layer covering at least a portion of the first metal layer and having a via hole exposing at least a portion of an upper surface of the first metal layer; a first seed met...