US Patent Issued to SAMSUNG ELECTRO-MECHANICS on Feb. 3 for "Multilayer electronic component and method for manufacturing multilayer electronic component" (South Korean Inventors)

ALEXANDRIA, Va., Feb. 3 -- United States Patent no. 12,542,239, issued on Feb. 3, was assigned to SAMSUNG ELECTRO-MECHANICS Co. LTD. (Suwon-si, South Korea).

"Multilayer electronic component and method for manufacturing multilayer electronic component" was invented by Hyeg Soon An (Suwon-si, South Korea), Hui Sun Park (Suwon-si, South Korea), Jeong Wook Seo (Suwon-si, South Korea), Tae Hyung Kim (Suwon-si, South Korea), Hee Sun Chun (Suwon-si, South Korea), Hyo Ju Lee (Suwon-si, South Korea), Jin Woo Kim (Suwon-si, South Korea) and Seok Hyun Yoon (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A multilayer electronic component includes a body including a dielectric layer and an internal...