ALEXANDRIA, Va., Feb. 3 -- United States Patent no. 12,542,238, issued on Feb. 3, was assigned to SAMSUNG ELECTRO-MECHANICS Co. LTD. (Suwon-si, South Korea).
"Multilayer electronic component" was invented by Yong Jun Lim (Suwon-si, South Korea), Bae Soon Son (Suwon-si, South Korea), Sung Hyung Kang (Suwon-si, South Korea), Kyung Ho Lee (Suwon-si, South Korea), Se Na Bae (Suwon-si, South Korea), Hye Jin Jin (Suwon-si, South Korea) and Sang Eon Park (Suwon-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A body including a dielectric layer and internal electrodes disposed alternately with the dielectric layer interposed therebetween; and external electrodes disposed on the body, wherein the diele...