ALEXANDRIA, Va., Feb. 19 -- United States Patent no. 12,230,445, issued on Feb. 18, was assigned to SAMSUNG ELECTRO-MECHANICS Co. LTD. (Suwon-si, South Korea).
"Multilayer electronic component" was invented by Bon Hyeong Koo (Suwon-si, South Korea), Seok Hyun Yoon (Suwon-si, South Korea), In Ho Jeon (Suwon-si, South Korea), Byung Kil Yun (Suwon-si, South Korea), Se Yong Kim (Suwon-si, South Korea), Min Jung Jang (Suwon-si, South Korea) and Geon Hoi Kim (Suwon-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A multilayer electronic component includes a body including a dielectric layer and internal electrodes; and an external electrode disposed on the body, wherein the dielectric layer includes ...