ALEXANDRIA, Va., Dec. 9 -- United States Patent no. 12,495,490, issued on Dec. 9, was assigned to SAMSUNG ELECTRO-MECHANICS Co. LTD. (Suwon-si, South Korea).
"Printed circuit board and manufacturing method thereof" was invented by Young Kuk Ko (Suwon-si, South Korea), Sanghoon Kim (Suwon-si, South Korea), Jiho Yoon (Suwon-si, South Korea), Gyumook Kim (Suwon-si, South Korea) and Taehun Kim (Suwon-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A printed circuit board: a first insulation layer; a first wiring layer embedded in the first insulation layer; a first via layer disposed in a first via of the first insulation layer; a second insulation layer disposed on the first insulation layer; a s...