ALEXANDRIA, Va., Dec. 31 -- United States Patent no. 12,512,269, issued on Dec. 30, was assigned to SAMSUNG ELECTRO-MECHANICS Co. LTD. (Suwon-si, South Korea).
"Multilayer electronic component" was invented by Won Su Son (Suwon-si, South Korea) and Ki Pyo Hong (Suwon-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A multilayer electronic component includes: a body including a dielectric layer and first and second internal electrodes stacked in a third direction, and including first and second surfaces in a first direction, and third and fourth surfaces in a second direction; first external electrodes respectively disposed on the first and second surfaces, extended onto the third and fourth sur...