US Patent Issued to SAMSUNG ELECTRO-MECHANICS on Dec. 2 for "Multilayer electronic component having moisture-and hydrogen-resistant interfacial structure" (South Korean Inventors)

ALEXANDRIA, Va., Dec. 2 -- United States Patent no. 12,488,943, issued on Dec. 2, was assigned to SAMSUNG ELECTRO-MECHANICS Co. LTD. (Suwon-si, South Korea).

"Multilayer electronic component having moisture-and hydrogen-resistant interfacial structure" was invented by Da Mi Kim (Suwon-si, South Korea), Bum Suk Kang (Suwon-si, South Korea), Su Jin Lee (Suwon-si, South Korea) and Dae Woo Yoon (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A multilayer electronic component is provided, the multilayer electronic component, including: a body including a dielectric layer and internal electrodes alternately disposed with the dielectric layer interposed therebetween in a first direction, the b...