ALEXANDRIA, Va., Dec. 2 -- United States Patent no. 12,488,945, issued on Dec. 2, was assigned to SAMSUNG ELECTRO-MECHANICS Co. LTD. (Suwon-si, South Korea).
"Multilayer electronic component" was invented by Chan Hee Nam (Suwon-si, South Korea), Oh Hun Gwon (Suwon-si, South Korea), Jae Hyun Park (Suwon-si, South Korea), Kwan Yeol Paek (Suwon-si, South Korea), Chang Geon Lee (Suwon-si, South Korea) and Hae Suk Chung (Suwon-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A multilayer electronic component includes a body including a dielectric layer and internal electrodes; and external electrodes disposed on the body, wherein the dielectric layer includes a plurality of dielectric grains having ...