US Patent Issued to SAMSUNG ELECTRO-MECHANICS on Dec. 16 for "Multilayer electronic component and board having multilayer electronic component mounted thereon" (South Korean Inventors)

ALEXANDRIA, Va., Dec. 16 -- United States Patent no. 12,500,035, issued on Dec. 16, was assigned to SAMSUNG ELECTRO-MECHANICS Co. LTD. (Suwon-si, South Korea).

"Multilayer electronic component and board having multilayer electronic component mounted thereon" was invented by Hwi Dae Kim (Suwon-si, South Korea) and Young Ghyu Ahn (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A multilayer electronic component includes a body including a dielectric layer and an internal electrode, and an external electrode disposed on the body. The internal electrode is connected to the external electrode through a lead-out portion. With respect to a cross-section of the internal electrode in the second a...