ALEXANDRIA, Va., Dec. 16 -- United States Patent no. 12,500,037, issued on Dec. 16, was assigned to SAMSUNG ELECTRO-MECHANICS Co. LTD. (Suwon-si, South Korea).
"Multilayer electronic component" was invented by Sim Chung Kang (Suwon-si, South Korea), Jong Ho Lee (Suwon-si, South Korea), Eun Jung Lee (Suwon-si, South Korea), Hyun Sik Chae (Suwon-si, South Korea), Sun Mi Kim (Suwon-si, South Korea) and Dae Jin Shim (Suwon-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A multilayer electronic component includes a body including a dielectric layer and internal electrodes alternately disposed with the dielectric layer in a first direction; external electrodes disposed on the body; and side margin p...