US Patent Issued to SAMSUNG ELECTRO-MECHANICS on Dec. 16 for "Circuit board and manufacturing method thereof" (South Korean Inventors)

ALEXANDRIA, Va., Dec. 16 -- United States Patent no. 12,501,547, issued on Dec. 16, was assigned to SAMSUNG ELECTRO-MECHANICS Co. LTD. (Suwon-si, South Korea).

"Circuit board and manufacturing method thereof" was invented by Keesu Jeon (Suwon-si, South Korea), Kieun Cho (Suwon-si, South Korea), Myeonghui Jung (Suwon-si, South Korea), Minjae Seong (Suwon-si, South Korea) and Sanghoon Kim (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A circuit board according to an embodiment may include a first insulating layer, a first wiring layer that is buried in the first insulating layer, a first via layer that is disposed in the first insulating layer, and a second insulating layer that is dispo...