ALEXANDRIA, Va., Aug. 6 -- United States Patent no. 12,382,580, issued on Aug. 5, was assigned to SAMSUNG ELECTRO-MECHANICS Co. LTD. (Suwon-si, South Korea).
"Printed circuit board, printed circuit board with carrier and method for manufacturing printed circuit board package" was invented by Jung Han Kim (Suwon-si, South Korea) and Youn Gyu Han (Suwon-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A printed circuit board includes: a plurality of insulating layers; a plurality of wiring pattern layers disposed on at least one surface of the plurality of insulating layers; a via connecting wiring pattern layers, among the plurality of wiring pattern layers, disposed on upper and lower surfaces ...