ALEXANDRIA, Va., Aug. 26 -- United States Patent no. 12,400,791, issued on Aug. 26, was assigned to SAMSUNG ELECTRO-MECHANICS Co. LTD. (Suwon-si, South Korea).
"Multilayer electronic component" was invented by Hyun Jun Hwang (Suwon-si, South Korea), Jin Kyung Park (Suwon-si, South Korea), Sun Il Jeong (Suwon-si, South Korea), Gil Yong Lee (Suwon-si, South Korea), Su Ji Kang (Suwon-si, South Korea), Mun Seong Jeong (Suwon-si, South Korea), Won Seok Jang (Suwon-si, South Korea) and Jung Min Kim (Suwon-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A multilayer electronic component including: a body including a dielectric layer and internal electrodes; and external electrodes disposed outside th...