US Patent Issued to SAMSUNG ELECTRO-MECHANICS on Aug. 12 for "Multilayer electronic component and method of manufacturing multilayer electronic component" (South Korean Inventors)

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,387,879, issued on Aug. 12, was assigned to SAMSUNG ELECTRO-MECHANICS Co. LTD. (Suwon-si, South Korea).

"Multilayer electronic component and method of manufacturing multilayer electronic component" was invented by Ji Hyeon Lee (Suwon-si, South Korea), Jong Ho Lee (Suwon-si, South Korea), Eun Jung Lee (Suwon-si, South Korea), Yong Min Hong (Suwon-si, South Korea), Yong Park (Suwon-si, South Korea), Min Woo Kim (Suwon-si, South Korea), Jung Tae Park (Suwon-si, South Korea), Sun Mi Kim (Suwon-si, South Korea) and Sim Chung Kang (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method of manufacturing a multilayer electronic component,...