ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,387,876, issued on Aug. 12, was assigned to SAMSUNG ELECTRO-MECHANICS Co. LTD. (Suwon-si, South Korea).
"Multilayer electronic component" was invented by Sin Il Gu (Suwon-si, South Korea) and Jin Hyung Lim (Suwon-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A multilayer electronic component includes a body including first and second surfaces facing each other in a first direction, and third and fourth surfaces connected to the first and second surfaces and facing each other in a second direction, and including a capacitance forming portion including a dielectric layer and first and second internal electrodes alternately disposed with t...