ALEXANDRIA, Va., April 9 -- United States Patent no. 12,272,497, issued on April 8, was assigned to SAMSUNG ELECTRO-MECHANICS Co. LTD. (Suwon-si, South Korea).
"Multilayer electronic component" was invented by Hee Jung Jung (Suwon-si, South Korea), Jun Il Kang (Suwon-si, South Korea), Jong Rock Lee (Suwon-si, South Korea), Chung Yeol Lee (Suwon-si, South Korea), Cheong Kim (Suwon-si, South Korea), Jin Hyung Lim (Suwon-si, South Korea) and Hiroki Okada (Suwon-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A multilayer electronic component according to an embodiment of the present disclosure includes a body including a dielectric layer and internal electrodes; and an external electrode disposed...