US Patent Issued to SAMSUNG ELECTRO-MECHANICS on April 22 for "Multilayered electronic component and method of manufacturing the same" (South Korean Inventors)

ALEXANDRIA, Va., June 6 -- United States Patent no. 12,283,433, issued on April 22, was assigned to SAMSUNG ELECTRO-MECHANICS Co. LTD. (Suwon-si, South Korea).

"Multilayered electronic component and method of manufacturing the same" was invented by Jae Hoon Jeong (Suwon-si, South Korea), Hyun Woong Na (Suwon-si, South Korea) and Yun Jeong Cha (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A multilayer electronic component includes: a body including a dielectric layer, and an internal electrode alternately disposed with the dielectric layer; and an external electrode disposed on the body and connected to the internal electrode. A composite layer containing Sn and Ni is disposed at an in...