ALEXANDRIA, Va., June 6 -- United States Patent no. 12,283,431, issued on April 22, was assigned to SAMSUNG ELECTRO-MECHANICS Co. LTD. (Suwon-si, South Korea).
"Multilayer electronic component" was invented by Su Yun Yun (Suwon-si, South Korea), Hong Je Choi (Suwon-si, South Korea), Ji Hye Han (Suwon-si, South Korea), Byung Woo Kang (Suwon-si, South Korea), Hye Jin Park (Suwon-si, South Korea), Sang Wook Lee (Suwon-si, South Korea) and Jung Min Kim (Suwon-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A multilayer electronic component includes a body including a dielectric layer and first and second internal electrodes, first and second external electrodes respectively disposed on opposing su...