ALEXANDRIA, Va., June 5 -- United States Patent no. 12,278,052, issued on April 15, was assigned to SAMSUNG ELECTRO-MECHANICS Co. LTD. (Suwon-si, South Korea).
"Multilayer electronic component" was invented by Hee Sun Chun (Suwon-si, South Korea), Jin Woo Kim (Suwon-si, South Korea), Tae Hyung Kim (Suwon-si, South Korea), Hyo Ju Lee (Suwon-si, South Korea), Seok Hyun Yoon (Suwon-si, South Korea) and Jeong Ryeol Kim (Suwon-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A multilayer electronic component includes a body including a dielectric layer including a plurality of dielectric grains and internal electrodes alternately disposed with the dielectric layer in a first direction and external e...