ALEXANDRIA, Va., June 12 -- United States Patent no. 12,302,738, issued on May 13, was assigned to SAMSUNG DISPLAY Co. LTD. (Gyeonggi-Do, South Korea).
"Bonding device and method of manufacturing display device using the same" was invented by Kisang Yoo (Asan-si, South Korea), Kyungrok Ko (Suwon-si, South Korea), Youngsu Kim (Gunpo-si, South Korea), Jaesuk Yoo (Seoul, South Korea) and Jeong-Seop Choi (Cheonan-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A bonding device includes: a support in which a plurality of through-holes is defined, a diaphragm disposed on the support to cover the support, a pressing pad disposed on the diaphragm over a top surface of the support, and a window fixing ...