ALEXANDRIA, Va., March 19 -- United States Patent no. 12,256,627, issued on March 18, was assigned to SAMSUNG DISPLAY Co. LTD. (Gyeonggi-Do, South Korea).
"Bonding device and method of fabricating display device using the same" was invented by Taehyeog Jung (Hwaseong-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A bonding device includes: a stage and a pressing part, which is placed on the stage and is movable toward the stage. A first layer, which is disposed on an upper surface of the stage, includes a first flat portion and first bending portions. A second layer, which is disposed below a lower surface of the pressing part, includes a second flat portion and second bending portions. The f...