ALEXANDRIA, Va., June 25 -- United States Patent no. 12,340,719, issued on June 24, was assigned to SAMSUNG DISPLAY Co. LTD. (Gyeonggi-Do, South Korea).
"Chip-on-film package, display panel, and display device" was invented by Hee-Kwon Lee (Asan-si, South Korea) and Seungkyun Hong (Cheonan-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A chip-on-film package includes a base substrate on which a first pad region, a second pad region, and a third region located between the first pad region and the second pad region are defined, a dummy pad disposed on the first pad region, input pads disposed on the first pad region, output pads disposed on the second region, a first detection line disposed on ...