ALEXANDRIA, Va., Oct. 8 -- United States Patent no. 12,435,505, issued on Oct. 7, was assigned to SAI GROUP HOLDINGS K.K. (Fukuoka, Japan).
"Joint structure and building" was invented by Kenya Ebisu (Fukuoka, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "The present invention addresses the problem of providing a joint structure which comprises a joint member suitable for a butterfly joint, and a building. The joint structure according to the present invention includes a first wood panel, a second wood panel, and a butterfly wedge-shaped joint member for joining the first wood panel and the second wood panel. The joint structure has an allowable yield strength of about 10 kN or more. In one embodiment,...