ALEXANDRIA, Va., Nov. 25 -- United States Patent no. 12,482,784, issued on Nov. 25, was assigned to S.S.P. INC. (Incheon, South Korea).
"Method for controlling boat/strip type solder ball placement system" was invented by Kyouho Lee (Suwon-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "Proposed is a method for controlling a boat carrier/substrate strip type solder ball placement system that allows solder ball mounting processes for a boat carrier type of a material and a substrate strip type of a material to be all performed in one system. In specific, the method allows the components or operation setting of the system to be automatically controlled according to the types of materials loaded ...