US Patent Issued to Ruijie Networks on March 4 for "Heat dissipation structure for optoelectronic module and electronic device" (Chinese Inventors)

ALEXANDRIA, Va., March 5 -- United States Patent no. 12,242,121, issued on March 4, was assigned to Ruijie Networks Co. Ltd. (Fuzhou, China).

"Heat dissipation structure for optoelectronic module and electronic device" was invented by Xiaolong Lv (Fujian, China), Wei Liu (Fujian, China) and Guohong Lai (Fujian, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "This application discloses a heat dissipation structure for an optoelectronic module and an electronic device. The heat dissipation structure includes: an electronic chip; a plurality of optical engines, the plurality of optical engines being distributed along a periphery of the electronic chip; and a cold plate. The cold plate includes: a main cold...