US Patent Issued to RTX on June 24 for "Through thickness reinforcement" (Connecticut Inventor)

ALEXANDRIA, Va., June 25 -- United States Patent no. 12,338,182, issued on June 24, was assigned to RTX Corp. (Farmington, Conn.).

"Through thickness reinforcement" was invented by Olivier H. Sudre (Glastonbury, Conn.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method for making a ceramic matrix composite component includes densifying a fibrous preform of the component with a ceramic matrix to form an intermediate component; infiltrating a hole in the intermediate component with an infiltrate material comprising a solid and a metallic alloy whose reaction forms a carbide, silicide, boride or combination thereof, heating the infiltrate material to a temperature in excess of a melting point of the metalli...