ALEXANDRIA, Va., June 5 -- United States Patent no. 12,275,601, issued on April 15, was assigned to RORZE Corp. (Hiroshima, Japan).
"Wafer transfer apparatus and wafer transfer method" was invented by Kouta Osaka (Hiroshima, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "An object of the invention is to realize a high transfer throughput in a wafer transfer apparatus in which a wafer transfer robot transfers a wafer via an aligner. A wafer transfer apparatus includes a wafer transfer robot, and a separation dimension between a pair of wafer holding rods forming a finger of the wafer transfer robot is set to be larger than a dimension of a body portion of an aligner in a width direction provided in the ...