US Patent Issued to ROHM on Sept. 9 for "Semiconductor package with plurality of leads and sealing resin" (Japanese Inventor)

ALEXANDRIA, Va., Sept. 10 -- United States Patent no. 12,412,812, issued on Sept. 9, was assigned to ROHM Co. LTD. (Kyoto, Japan).

"Semiconductor package with plurality of leads and sealing resin" was invented by Mamoru Yamagami (Kyoto, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes a semiconductor chip, a plurality of leads that each includes a lead body portion which has a mounting portion which includes an upper surface whereon a semiconductor chip is bonded, and a lead connecting portion for external connection which projects downward from a lower surface of the lead body portion, a first sealing resin that seals a space that is defined by each lead body portion and ...